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July 29, 2008

New Physics Publications by BU Researchers

Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints
Bieler, Thomas R.; Jiang, Hairong; Lehman, Lawrence P.; Kirkpatrick, Tim; Cotts, Eric J.; Nandagopal, Bala
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 31 (2): 370-381 JUN 2008

Saturation of intersubband transitions in p-doped GaAs/AlGaAs quantum wells
Steed, Robert; Matthews, Mary; Plumridge, Jonathan; Frogley, Mark; Phillips, Chris; Ikonic, Zoran; Harrison, Paul; Malis, Oana; Pfeiffer, Loren N.; West, Kenneth W.
APPLIED PHYSICS LETTERS 92 (18): Art. No. 183104 MAY 5 2008

Posted by ebrown at July 29, 2008 09:55 AM