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February 13, 2008

New Systems Science and Industrial Engineering Publications by BU Researchers

Implementing 0201s on high-density lead-free memory modules
Authors: Iyer, Satyanarayan; Sajjala, Sandeep; Damodaran, Purushothaman; Srihari, Krishnaswami
Source: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 31 (1): 41-50 JAN 2008

Are hook turns a major obstacle to safe skydiving? A study of skydiving fatalities in the United States from 1992 to 2005
Authors: Vidovic, Martina; Rugai, Nick
Source: PERCEPTUAL AND MOTOR SKILLS 105 (3): 795-802 Part 1 DEC 2007

Assembly issues with Sn/Ag/Cu bumped flip chips
Authors: Gopakumar, Sunil; Borgesen, Peter; Srihari, I.
Source: SOLDERING & SURFACE MOUNT TECHNOLOGY 19 (4): 3-10 2007

Posted by jdixon at February 13, 2008 03:40 PM