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April 09, 2007

Recent Mechanical Engineering Publications by BU Researchers

Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks" (vol 24, pg 1780, 2006)
Arunasalam, Parthiban; Ackler, Harold D.; Sammakia, Bahgat G.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 25 (1): 292-292 JAN-FEB 2007

Shorter field life-in power cycling for organic packages
Park, S. B.; Ahmed, Izhar Z.
JOURNAL OF ELECTRONIC PACKAGING 129 (1): 28-34 MAR 2007

Posted by ebrown at April 9, 2007 12:32 PM