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March 14, 2007

Recent Mechanical Engineering Publications by BU Researchers

Effects of phase change of Pb-free flip-chip solders during board-level interconnect reflow
Chung, Soonwan; Tang, Zhenming; Park, Seungbae
IEEE TRANSACTIONS ON ADVANCED PACKAGING 30 (1): 38-43 FEB 2007

Adaptive finite element methodology for tumour angiogenesis modelling
Peterson, J. W.; Carey, G. F.; Knezevic, D. J.; Murray, B. T.
INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING 69 (6): 1212-1238 FEB 5 2007

Posted by ebrown at March 14, 2007 10:11 AM