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February 15, 2007
CINDAS Database now available
The Libraries is happy to announce that access to the CINDAS Microelectronics Packaging Materials Database is now available.
The database contains data on thermal, mechanical, electrical and physical properties of electronics packaging materials. Over 750 materials and over 15,000 data curves were developed under the sponsorship of the Semiconductor Research Corporation. Data is searchable by material group, material name, property group, property name and independent variables.
Posted by ebrown at February 15, 2007 10:28 AM