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January 12, 2007

New Mechanical Engineering Publications by BU Researchers

Evaluation of die stress in MEMS packaging: Experimental and theoretical approaches
Walwadkar, Satyajit S.; Cho, Junghyun
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 29 (4): 735-742 DEC 2006

Model of shear viscosity for underfill flows
Yang, R.; Sun, D. C.; Park, Seungbae
JOURNAL OF ELECTRONIC MATERIALS 35 (11): 2016-2025 NOV 2006

Effect of settlement on dense slurry flow in a horizontal channel
Yang, R.; Sun, D. C.; Park, Seungbae
JOURNAL OF ELECTRONIC MATERIALS 35 (11): 2026-2034 NOV 2006

Posted by ebrown at January 12, 2007 10:38 AM